Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed
Tupciauskas R; Orlovskis Z; Blums KT; Liepins J; Berzins A; Pavlovics G; Andzs M · 2024 · Preprint
WASTE classifies this as Negative / Null Result Report · AI classification, approximate
The study found no significant effect — useful as a negative control or null benchmark for your own design.
Abstract (excerpt)
The present study evaluates mold fungal resistance of newly developed loose-fill thermal insulation materials from wheat straw, corn stalk and water reed. Three different processing methods of raw materials was performed by mechanical…
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Metadata source: Europe PMC · DOI 10.20944/preprints202401.1452.v1